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| 1. general description the tja1051 is a high-speed can transceiver that provides an interface between a controller area network (can) protocol c ontroller and the physical two-wire can bus. the transceiver is designed for high-speed ( up to 1 mbit/s) can applications in the automotive industry, providin g differential transmit and receive capability to (a microcontroller with) a can protocol controller. the tja1051 belongs to the third generation of high-speed can transceivers from nxp semiconductors, offering significant improv ements over first- and second-generation devices such as the tja1050. it offers improved electromagnetic compatibility (emc) and electrostatic discharge (esd) performance, and also features: ? ideal passive behavior to the can bus when the supply voltage is off ? tja1051t/3 and tja1051tk/3 can be interfac ed directly to microcontrollers with supply voltages from 3vto5v these features make the tja1051 an excellent choice for all types of hs-can networks, in nodes that do not requ ire a standby mode with wake-up capability via the bus. 2. features and benefits 2.1 general ? fully iso 11898-2 compliant ? suitable for 12 v and 24 v systems ? low electromagnetic emission (eme) and high electromagnetic immunity (emi) ? v io input on tja1051t/3 and tja1051tk/3 a llows for direct interfacing with 3 v to 5 v microcontrollers (available in so8 and ve ry small hvson8 packages respectively) ? en input on tja1051t/e allows the microcontr oller to switch the transceiver to a very low-current off mode 2.2 low-power management ? functional behavior predictable under all supply conditions ? transceiver disengages from the bus when not powered up (zero load) 2.3 protection ? high electrostatic discharge (esd) handling capability on the bus pins ? bus pins protected against transients in automotive environments ? transmit data (txd) dominant time-out function ? undervoltage detection on pins v cc and v io tja1051 high-speed can transceiver rev. 5 ? 29 december 2010 product data sheet
tja1051 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 29 december 2010 2 of 21 nxp semiconductors tja1051 high-speed can transceiver ? thermally protected 3. quick reference data 4. ordering information [1] tja1051t/3 and tja1051tk/3 with v io pin; tja1051t/e with en pin. table 1. quick reference data symbol parameter conditions min typ max unit v cc supply voltage 4.5 - 5.5 v v uvd(vcc) undervoltage detection voltage on pin v cc 3.5- 4.5v i cc supply current silent mode 0.1 1 2.5 ma normal mode; bus recessive 2.5 5 10 ma normal mode; bus dominant 20 50 70 ma v esd electrostatic discharge voltage iec 61000-4-2 at pins canh and canl ? 8- +8kv v canh voltage on pin canh no time limit; dc limiting value ? 58 - +58 v v canl voltage on pin canl no time limit; dc limiting value ? 58 - +58 v t vj virtual junction temperature ? 40 - +150 ?c table 2. ordering information type number package name description version tja1051t so8 plastic small outline package; 8 leads; body width 3.9 mm sot96-1 tja1051t/3 [1] so8 plastic small outline package; 8 leads; body width 3.9 mm sot96-1 tja1051t/e [1] so8 plastic small outline package; 8 leads; body width 3.9 mm sot96-1 tja1051tk/3 [1] hvson8 plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 3 ? 3 ? 0.85 mm sot782-1 tja1051 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 29 december 2010 3 of 21 nxp semiconductors tja1051 high-speed can transceiver 5. block diagram (1) in a transceiver without a v io pin, the v io input is internally connected to v cc . (2) only present in the tja1051t/e. fig 1. block diagram temperature protection time-out mode control driver txd 1 v i/o (1) s 8 en (2) 5 rxd 4 slope control and driver v cc canh canl 7 6 53 2 gnd tja1051 015aaa036 v cc v io (1) tja1051 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 29 december 2010 4 of 21 nxp semiconductors tja1051 high-speed can transceiver 6. pinning information 6.1 pinning 6.2 pin description a. tja1051t: so8 b. tja1051t/e: so8 c. tja1051t/3: so8 d. tja1051tk/3: hvson8 fig 2. pin configuration diagrams txd s gnd canh v cc canl rxd n.c. 015aaa225 1 2 3 4 6 5 8 7 tja1051t txd s gnd canh v cc canl rxd en 015aaa223 1 2 3 4 6 5 8 7 tja1051t/e txd s gnd canh v cc canl rxd v io 015aaa224 1 2 3 4 6 5 8 7 tja1051t/3 015aaa222 tja1051tk/3 v io v cc rxd canl gnd canh txd s transparent top view 4 5 3 6 2 7 1 8 terminal 1 index area table 3. pin description symbol pin description txd 1 transmit data input gnd 2 ground v cc 3 supply voltage rxd 4 receive data output; reads out data from the bus lines n.c. 5 not connected; in tja1051t version en 5 enable control input; tja1051t/e only v io 5 supply voltage for i/o level adapter; tja1051t/3 and tja1051tk/3 only canl 6 low-level can bus line canh 7 high-level can bus line s 8 silent mode control input tja1051 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 29 december 2010 5 of 21 nxp semiconductors tja1051 high-speed can transceiver 7. functional description the tja1051 is a high-speed can stand-alone transceiver with silent mode. it combines the functionality of the tja1050 transceiver with improved emc and esd handling capability. improved slope control and high dc handling capability on the bus pins provides additional application flexibility. the tja1051 is available in three versions, di stinguished only by the function of pin 5: ? the tja1051t is 100 % backwards compatible with the tja1050 ? the tja1051t/3 and tja1051tk/3 allow for direct interfacing to microcontrollers with supply voltages down to 3 v ? the tja1051t/e allows the transceiver to be switched to a very low-current off mode. 7.1 operating modes the tja1051 supports two operating modes, normal and silent, which are selected via pin s. an additional off mode is suppo rted in the tja1051t/e via pin en. see ta b l e 4 for a description of the operating modes under normal supply conditions. [1] only available on the tja1051t/e. [2] low if the can bus is dominant, high if the can bus is recessive. [3] ?x? = don?t care. 7.1.1 normal mode a low level on pin s selects normal mode. in this mode, the transceiver is able to transmit and receive data via the bus lines canh and canl (see figure 1 for the block diagram). the differential receiver converts the analog data on the bus lines into digital data which is output to pin rxd. the slope of the output signals on the bus lines is controlled and optimized in a way that guarantees the lowest possible electromagnetic emission (eme). 7.1.2 silent mode a high level on pin s selects silent mode. in silent mode the transmitter is disabled, releasing the bus pins to recessive state. a ll other ic functions, including the receiver, continue to operate as in normal mode. silent mode can be used to prevent a faulty can controller from disrupting all network communications. table 4. operating modes mode inputs outputs pin en [1] pin s pin txd can driver pin rxd normal high low low dominant active [2] high low high recessive active [2] silent high high x [3] recessive active [2] off [1] low x [3] x [3] floating floating tja1051 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 29 december 2010 6 of 21 nxp semiconductors tja1051 high-speed can transceiver 7.1.3 off mode a low level on pin en of tja1051t/e selects off mode. in off mode the entire transceiver is disabled, allowing the mi crocontroller to sa ve power when can communication is not required. the bus pins are floating in off mode, making the transceiver invisible to the rest of the network. 7.2 fail-safe features 7.2.1 txd dominant time-out function a ?txd dominant time-out? timer is started w hen pin txd is set low. if the low state on pin txd persists for longer than t to(dom)txd , the transmitter is disabled, releasing the bus lines to recessive state. this function prev ents a hardware and/or software application failure from driving the bus lines to a permanent dominant state (blocking all network communications). the txd dominant time-out timer is reset when pin txd is set high. the txd dominant time-out time also defines the minimum possible bit rate of 40 kbit/s. 7.2.2 internal biasing of txd, s and en input pins pin txd has an internal pull-up to v io and pins s and en (tja1051t/e) have internal pull-downs to gnd. this ensures a safe, defined state in case one or more of these pins is left floating. 7.2.3 undervoltage detection on pins v cc and v io should v cc or v io drop below their respective undervoltage detection levels (v uvd(vcc) and v uvd (vio) ; see ta b l e 7 ), the transceiver will switch of f and disengage from the bus (zero load) until v cc and v io have recovered. 7.2.4 overtemperature protection the output drivers are protected against overte mperature conditions. if the virtual junction temperature exceeds the shutdo wn junction temperature, t j(sd) , the output drivers will be disabled until the virtual junction temperature falls below t j(sd) and txd becomes recessive again. including the txd condition ensu res that output driver oscillations due to temperature drift are avoided. 7.3 v io supply pin there are three versions of the tja1051 availabl e, only differing in the function of a single pin. pin 5 is either an enable control input (en), a v io supply pin or is not connected. pin v io on the tja1051t/3 and tja1051tk/3 should be connected to the microcontroller supply voltage (see figure 6 ). this will adjust the signal levels of pins txd, rxd and s to the i/o levels of the microcontroller. fo r versions of the tja1051 without a v io pin, the v io input is internally connected to v cc . this sets the signal levels of pins txd, rxd and s to levels compatible with 5 v microcontrollers. tja1051 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 29 december 2010 7 of 21 nxp semiconductors tja1051 high-speed can transceiver 8. limiting values [1] verified by an external test house to ensure pins canh and canl can withstand iso 7637 part 3 automotive transient test pulses 1, 2a, 3a and 3b. [2] iec 61000-4-2 (150 pf, 330 ? ). [3] esd performance of pins canh and canl according to iec 61000-4-2 (150 pf, 330 ? ) has been be verified by an external test house. the result is equal to or better than ? 8 kv (unaided). [4] human body model (hbm): according to aec-q100-002 (100 pf, 1.5 k ? ). [5] machine model (mm): according to aec-q100-003 (200 pf, 0.75 ? h, 10 ? ). [6] charged device model (cdm): according to aec-q100-011 (field induced charge; 4 pf). the classi fication level is c5 (> 1000 v ). [7] in accordance with iec 60747-1. an alternative definition of virtual junction temperature is: t vj =t amb +p ? r th(vj-a) , where r th(vj-a) is a fixed value to be used for the calculation of t vj . the rating for t vj limits the allowable combinations of power dissipation (p) and ambient temperature (t amb ). 9. thermal characteristics table 5. limiting values in accordance with the absolute maximum rating syst em (iec 60134). all voltages are referenced to gnd. symbol parameter conditions min max unit v x voltage on pin x no time limit; dc value on pins canh and canl ? 58 +58 v on any other pin ? 0.3 +7 v v trt transient voltage on pins canh and canl [1] ? 150 +100 v v esd electrostatic discharge voltage iec 61000-4-2 [2] at pins canh and canl [3] ? 8+8 kv hbm [4] at pins canh and canl ? 8+8 kv at any other pin ? 4+4 kv mm [5] at any pin ? 300 +300 v cdm [6] at corner pins ? 750 +750 v at any pin ? 500 +500 v t vj virtual junction temperature [7] ? 40 +150 ?c t stg storage temperature ? 55 +150 ?c t amb ambient temperature ? 40 +125 ?c table 6. thermal characteristics according to iec 60747-1. symbol parameter conditions value unit r th(vj-a) thermal resistance from virtual junction to ambient so8 package; in free air 155 k/w hvson8 package; in free air 55 k/w tja1051 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 29 december 2010 8 of 21 nxp semiconductors tja1051 high-speed can transceiver 10. static characteristics table 7. static characteristics t vj = ? 40 ? c to +150 ? c; v cc = 4.5 v to 5.5 v; v io = 2.8 v to 5.5 v [1] ; r l =60 ? unless specified otherwise; all voltages are defined with respect to ground; positive currents flow into the ic [2] . symbol parameter conditions min typ max unit supply; pin v cc v cc supply voltage 4.5 - 5.5 v i cc supply current off mode (tja1051t/e) 1 5 8 ? a silent mode 0.1 1 2.5 ma normal mode recessive; v txd =v io -510ma dominant; v txd =0v - 50 70 ma v uvd(vcc) undervoltage detection voltage on pin v cc 3.5 - 4.5 v i/o level adapter supply; pin v io [1] v io supply voltage on pin v io 2.8 - 5.5 v i io supply current on pin v io normal and silent modes recessive; v txd =v io -80250 ? a dominant; v txd = 0 v - 350 500 ? a v uvd(vio) undervoltage detection voltage on pin v io 1.3 - 2.7 v mode control inputs; pins s and en [3] v ih high-level input voltage [4] 0.7v io -v io +0.3 v v il low-level input voltage ? 0.3 - 0.3v io v i ih high-level input current v s =v io ; v en =v io 1410 ? a i il low-level input current v s =0v; v en =0 v ? 10+1 ? a can transmit data input; pin txd v ih high-level input voltage [4] 0.7v io -v io +0.3 v v il low-level input voltage ? 0.3 - +0.3v io v i ih high-level input current v txd =v io ? 50+5 ? a i il low-level input current normal mode; v txd =0v ? 260 ? 150 ? 30 ? a c i input capacitance [5] -510pf can receive data output; pin rxd i oh high-level output current v rxd =v io ? 0.4 v; v io =v cc ? 8 ? 3 ? 1ma i ol low-level output current v rxd = 0.4 v; bus dominant 2 5 12 ma bus lines; pins canh and canl v o(dom) dominant output voltage v txd =0v; t tja1051 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 29 december 2010 11 of 21 nxp semiconductors tja1051 high-speed can transceiver 12. application information fig 4. can transceiver timing diagram canh canl t d(txd-busdom) txd v o(dif)(bus) rxd high high low low dominant recessive 0.9 v 0.5 v 0.3v io 0.7v io t d(busdom-rxd) t d(txd-busrec) t d(busrec-rxd) t pd(txd-rxd) t pd(txd-rxd) 015aaa025 fig 5. typical application of the tja1051t/e tja1051t/e en s txd rxd micro- controller pxx pyy tx0 rx0 vdd gnd gnd v cc canh canh canl canl 5 v bat 015aaa226 tja1051 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 29 december 2010 12 of 21 nxp semiconductors tja1051 high-speed can transceiver 13. test information 13.1 quality information this product has been qualified to the appropriate automotive electronics council (aec) standard q100 or q101 and is suitable for use in automotive applications. fig 6. typical application of the tja1051t/3 or tja1051tk/3. tja1051t/3 s txd rxd tja1051tk/3 micro- controller pxx pyy tx0 rx0 v dd gnd gnd v cc canh canh canl canl 5 v bat 3 v v io en 015aaa227 tja1051 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 29 december 2010 13 of 21 nxp semiconductors tja1051 high-speed can transceiver 14. package outline fig 7. package outline sot96-1 (so8) unit a max. a 1 a 2 a 3 b p cd (1) e (2) (1) eh e ll p qz ywv references outline version european projection issue date iec jedec jeita mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 0.7 0.6 0.7 0.3 8 0 o o 0.25 0.1 0.25 dimensions (inch dimensions are derived from the original mm dimensions) notes 1. plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 2. plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. 1.0 0.4 sot96-1 x w m a a 1 a 2 b p d h e l p q detail x e z e c l v m a (a ) 3 a 4 5 pin 1 index 1 8 y 076e03 ms-012 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.20 0.19 0.16 0.15 0.05 0.244 0.228 0.028 0.024 0.028 0.012 0.01 0.01 0.041 0.004 0.039 0.016 0 2.5 5 mm scale so8: plastic small outline package; 8 leads; body width 3.9 mm sot96-1 99-12-27 03-02-18 tja1051 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 29 december 2010 14 of 21 nxp semiconductors tja1051 high-speed can transceiver fig 8. package outline sot782-1 (hvson8) references outline version european projection issue date iec jedec jeita sot782-1 - - - - - - sot782-1_po 09-08-25 09-08-28 unit (1) mm max nom min 1.00 0.85 0.80 0.05 0.03 0.00 0.2 3.10 3.00 2.90 2.45 2.40 2.35 3.10 3.00 2.90 0.65 1.95 0.45 0.40 0.35 0.1 a dimensions note 1. plastic or metal protrusions of 0.075 maximum per side are not included. hvson8: plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 3 x 3 x 0.85 mm sot782-1 a 1 b 0.35 0.30 0.25 cdd h ee h 1.65 1.60 1.55 ee 1 k 0.35 0.30 0.25 lv 0.1 w 0.05 y 0.05 y 1 0 1 2 mm scale mo-229 x c y c y 1 detail x a c a 1 b a d e terminal 1 index area b d h l e h k e 1 e ac b v c w 1 4 8 5 terminal 1 index area tja1051 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 29 december 2010 15 of 21 nxp semiconductors tja1051 high-speed can transceiver 15. handling information all input and output pins are protected ag ainst electrostatic discharge (esd) under normal handling. when handling ensure that the appropriate precautions are taken as described in jesd625-a or equivalent standards. 16. soldering of smd packages this text provides a very brief insight into a complex technology. a more in-depth account of soldering ics can be found in application note an10365 ?surface mount reflow soldering description? . 16.1 introduction to soldering soldering is one of the most common methods through which packages are attached to printed circuit boards (pcbs), to form electr ical circuits. the soldered joint provides both the mechanical and the electrical connection. th ere is no single sold ering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mount devices (smds) are mixed on one printed wiring board; however, it is not suitable for fine pitch smds. reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 16.2 wave and reflow soldering wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. the wave soldering process is suitable for the following: ? through-hole components ? leaded or leadless smds, which are glued to the surface of the printed circuit board not all smds can be wave soldered. packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. also, leaded smds with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased pr obability of bridging. the reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. leaded packages, packages with solder balls, and leadless packages are all reflow solderable. key characteristics in both wave and reflow soldering are: ? board specifications, in cluding the board finish , solder masks and vias ? package footprints, including solder thieves and orientation ? the moisture sensitivit y level of the packages ? package placement ? inspection and repair ? lead-free soldering versus snpb soldering 16.3 wave soldering key characteristics in wave soldering are: tja1051 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 29 december 2010 16 of 21 nxp semiconductors tja1051 high-speed can transceiver ? process issues, such as application of adhe sive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave ? solder bath specifications, including temperature and impurities 16.4 reflow soldering key characteristics in reflow soldering are: ? lead-free versus snpb solderi ng; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see figure 9 ) than a snpb process, thus reducing the process window ? solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board ? reflow temperature profile; this profile includ es preheat, reflow (in which the board is heated to the peak temperature) and cooling down. it is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). in addition, the peak temperature must be low enough that the packages and/or boards are not damaged. the peak temperature of the package depends on package thickness and volume and is classified in accordance with ta b l e 9 and 10 moisture sensitivity precautions, as indicat ed on the packing, must be respected at all times. studies have shown that small packages reach higher temperatures during reflow soldering, see figure 9 . table 9. snpb eutectic process (from j-std-020c) package thickness (mm) package reflow temperature ( ?c) volume (mm 3 ) < 350 ? 350 < 2.5 235 220 ? 2.5 220 220 table 10. lead-free process (from j-std-020c) package thickness (mm) package reflow temperature ( ?c) volume (mm 3 ) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 tja1051 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 29 december 2010 17 of 21 nxp semiconductors tja1051 high-speed can transceiver for further information on temperature profiles, refer to application note an10365 ?surface mount reflow soldering description? . 17. soldering of hvson packages section 16 contains a brief introduction to the te chniques most commonly used to solder surface mounted devices (smd). a more detailed discussion on soldering hvson leadless package ics can found in the following application notes: ? an10365 ?surface mount reflow soldering description? ? an10366 ?hvqfn application information? msl: moisture sensitivity level fig 9. temperature profiles for large and small components 001aac844 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = msl limit, damage level peak temperature tja1051 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 29 december 2010 18 of 21 nxp semiconductors tja1051 high-speed can transceiver 18. revision history table 11. revision history document id release date data sheet status change notice supersedes tja1051 v.5 20101229 product data sheet - tja1051 v.4 modifications: ? tja1051t/e version added ? table 7 , ta b l e 8 : parameter values/conditions/notes updated ? section 15 ? handling information ? : added ? section 17 ? soldering of hvson packages ? : added tja1051 v.4 20091020 product data sheet - tja1051 v.3 tja1051 v.3 20090825 product data sheet - tja1051 v.2 tja1051 v.2 20090701 product data sheet - tja1051 v.1 tja1051 v.1 20090309 product data sheet - - tja1051 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 29 december 2010 19 of 21 nxp semiconductors tja1051 high-speed can transceiver 19. legal information 19.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 19.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 19.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use in automotive applications ? this nxp semiconductors product has been qua lified for use in automotive applications. the product is not desi gned, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be ex pected to result in personal injury, death or severe property or environmental dam age. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification. tja1051 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 29 december 2010 20 of 21 nxp semiconductors tja1051 high-speed can transceiver export control ? this document as well as the item(s) described herein may be subject to export control regu lations. export might require a prior authorization from national authorities. quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not comple te, exhaustive or legally binding. 19.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 20. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com nxp semiconductors tja1051 high-speed can transceiver ? nxp b.v. 2010. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 29 december 2010 document identifier: tja1051 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 21. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 2.1 general . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.2 low-power management . . . . . . . . . . . . . . . . . 1 2.3 protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 quick reference data . . . . . . . . . . . . . . . . . . . . . 2 4 ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 pinning information . . . . . . . . . . . . . . . . . . . . . . 4 6.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 functional description . . . . . . . . . . . . . . . . . . . 5 7.1 operating modes . . . . . . . . . . . . . . . . . . . . . . . 5 7.1.1 normal mode . . . . . . . . . . . . . . . . . . . . . . . . . . 5 7.1.2 silent mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 7.1.3 off mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 7.2 fail-safe features . . . . . . . . . . . . . . . . . . . . . . . 6 7.2.1 txd dominant time-out function . . . . . . . . . . . . 6 7.2.2 internal biasing of txd, s and en input pins . . 6 7.2.3 undervoltage detection on pins v cc and v io . . 6 7.2.4 overtemperat ure protection . . . . . . . . . . . . . . . 6 7.3 v io supply pin . . . . . . . . . . . . . . . . . . . . . . . . . . 6 8 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7 9 thermal characteristics . . . . . . . . . . . . . . . . . . 7 10 static characteristics. . . . . . . . . . . . . . . . . . . . . 8 11 dynamic characteristics . . . . . . . . . . . . . . . . . . 9 12 application information. . . . . . . . . . . . . . . . . . 11 13 test information . . . . . . . . . . . . . . . . . . . . . . . . 12 13.1 quality information . . . . . . . . . . . . . . . . . . . . . 12 14 package outline . . . . . . . . . . . . . . . . . . . . . . . . 13 15 handling information. . . . . . . . . . . . . . . . . . . . 15 16 soldering of smd packages . . . . . . . . . . . . . . 15 16.1 introduction to soldering . . . . . . . . . . . . . . . . . 15 16.2 wave and reflow soldering . . . . . . . . . . . . . . . 15 16.3 wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 15 16.4 reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 16 17 soldering of hvson packages. . . . . . . . . . . . 17 18 revision history . . . . . . . . . . . . . . . . . . . . . . . . 18 19 legal information. . . . . . . . . . . . . . . . . . . . . . . 19 19.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 19 19.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 19.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 19.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 20 20 contact information. . . . . . . . . . . . . . . . . . . . . 20 21 contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 |
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